TTTC's Electronic Broadcasting Service
Hi, just a reminder that you're receiving this email because you have expressed an interest in IEEE TTTC Office. Don't forget to add ebs@ieee-tttc.org to your address book so we'll be sure to land in your inbox!
You may unsubscribe if you no longer wish to receive our emails.
TTTC Header Image
TTTC's Electronic Broadcasting Service

37th IEEE VLSI Test Symposium 2019

(VTS19)
April 23-25, 2019
Monterey, CA 

http://tttc-vts.org/public_html/new/2019/


REGISTRATION DEADLINE APPROACHING!!!!
CALL FOR PARTICIPATION

Scope

The IEEE VLSI Test Symposium (VTS) explores emerging trends and novel concepts in testing, reliability and security of microelectronic circuits and systems.

Program Highlights

The VTS 2019 program starts with a keynote address from Abhinav Kandala, who is a member of the experimental quantum computing group at the IBM T.J. Watson Research Center. He will share the "challenges in design and test of superconducting quantum technology at IBM". 

This will be followed by an invited keynote address by Professor Patrick Groeneveld from Stanford University on “Secure and Reliable Automotive Drivetrains”.

The core of VTS 2019, the three days technical program, responds to the many trends and challenges in the semiconductor design and manufacturing industries, with papers and presentations in the research paper sessions covering the core set of test topics: Analog, Mixed-Signal; Hardware Security and Trust; Design Verification, Validation and Diagnosis; Delay & Performance Test; Test ATPG & Compression; On-Line Test & Error Correction; Embedded Systems & Board Test; Learning Based Diagnosis, Test and Security; Test Standards and Scan Test; Structural and Cell Aware Test; 2.5D, 3D and SiP Test.

In the framework of a new partnership with the China Test Conference (CTC) a session is dedicated to the presentation of three CTC best papers

VTS also hosts the E.J. McCluskey Doctoral Thesis Competition to showcase the exciting student research spanning all of the above topics.

VTS also continues its tradition of drawing the leading test practitioners and researchers in both industry and academia to contribute to the innovative practices (IP), special sessions, and new topic sessions, enabling it to be the venue where future technology trends and test challenges are debated, test practices are shared, and test research roadmaps are charted. In particular, this year’s program features the intersection of test, reliability, security, and Artificial Intelligence in many emerging and neighboring topics, in order to stimulate discussions and exchange of ideas beyond the traditional test community.  We have a rich offering of diverse topics in the IP and special sessions: Countering IP Security Threats in Supply Chain; Quality and Reliability Driven DFT and DFR Strategy for Automotive and Industrial Markets; Photonic IC Testing; Functional Test in Automotive; Delay Fault Testing; Reliability of Hardware-Implemented Spiking Neural Networks; Approximate Computing; IEEE 1687.xyz; DFT for AI Chips; Design for Test in State-of-the-Art Analog Systems; Machine Learning Applications in IC Test-Related Tasks; Cybersecurity; Software and Hardware based Silicon Debug / Fault Isolation; In-system Test and Reliability of Memories. Two new topic sessions are offered with focus on Photonic IC Testing and Emerging Computing and Testing Techniques.

The highly popular first day evening Wine-and-Cheese Panel discusses a number of issues in the emerging and inter-disciplinary field of AI-powered Security Validation and Test.  

The social program at VTS provides an opportunity for informal technical discussions among participants. 

Registration

Advance registrations are accepted until April 15, 2019 through the VTS website:

Hotel reservation is possible here:

http://tttc-vts.org/public_html/new/2019/hotel-reservation/

Additional Information

For further information, please, contact:

General chair:
Chen-Huan Chiang - Intel Inc. 
Email: chen-huan.chiang@intel.com

Program chairs:
Stefano Di Carlo (Politecnico di Torino)
Email: stefano.dicarlo@polito.it

Peilin Song (IBM Research)
Email: psong@us.ibm.com
Committee

General Chair:

  • Chen-Huan Chiang - Intel Inc.

Program Co-Chairs:

  • Stefano Di Carlo - Politecnico di Torino
  • Peilin Song - IBM Research

Past Chair:

  • Yiorgos Makris - University of Texas at Dallas

Vice-General Co-Chairs:

  • Lorena Anghel - University of Grenoble-Alpes / TIMA Laboratory
  • Srivaths Ravi - Texas Instruments
  • Amit Majumdar - Xilins

Vice-Program Co-Chairs:

  • Mehdi Tahoori - Karlsruhe Institute of Technology
  • Sule Ozev - Arizona State University

Innovative Practices Track Co-Chairs:

  • Peter Sarson - Dialog Semiconductor
  • John Carulli - Globalfoundries

Special Sessions Co-Chairs:

  • Jennifer Dworak - Southern Methodist University
  • Maria Michael - University of Cyprus

New Initiatives Co-Chairs:

  • Xiaowei Li - Chinese Academy of Sciences
  • Rohit Kapur - Synopsys

New Topics Co-Chairs:

  • Bernard Courtois - BC Consulting
  • Bozena Kaminska - Simon Fraser University

Corporate Support Co-Chairs:

  • Arani Sinha - Intel
  • Vivek Chickermane - Cadence

Finacne Chair:

  • Chintan Patel - Univ. of Maryland Baltimore County

Registration Chair:

  • Ke Huang - San Diego State University

Publications:
  • Ioana Vatajelu (Chair) - TIMA Laboratory
  • Giorgio Di Natale (Member) - TIMA Laboratory

Asian Initiative Chair:

  • Haruo Kobayashi - Gunma University

Publicity Co-Chairs:

  • Alessandro Savino - Politecnico di Torino
  • Huawei Li - Chinese Academy of Sciences

Local Arrangements Chair:

  • Suriya Natarajan - Intel

Audio/Visual Chair:

  • Ujjwal Guin - Auburn University

Ex-Officio:

  • Yervant Zorian - Synopsys
Student Activities Chair:
  • Naghmeh Karimi - University of Maryland, Baltimore County
Program committee
  • J. Abraham – University of Texas at Austin
  • V. Agrawal– Auburn University
  • C. Argyrides – AMD
  • M. Barragan – TIMA Laboratory
  • B. Becker – Universität Freiburg
  • R. Blanton – Carnegie Melon University
  • K. Chakrabarty – Duke University
  • T. Chakraborty – Qualcomm
  • M. Chao – NCTU
  • A. Chatterjee – Georgia Tech
  • D. Chen – Iowa State University
  • H. Chen – Mediatek
  • K. Chung – Qualcomm
  • J. Colburn – Nvidia
  • W. Dobbelaere – ON Semiconductor
  • D. Gizopoulos – University of Athens
  • S. Gupta – University of Southern California
  • S. Hellebrand – University of Paderborn
  • Y. Huang – Mentor Graphics
  • E. Larsson – Lund University
  • T.M. Mak – Independent
  • H. Manhaeve – Ridgetop
  • M. Maniatakos – NYU-AD
  • P. Maxwell – ON Semiconductor
  • S. Mir – TIMA Laboratory
  • Z. Navabi – WPI
  • A. Orailoglu – University of California, San Diego
  • I. Pomeranz – Purdue University
  • J. Rajski – Mentor Graphics
  • S. Reddy – University of Iowa
  • M. Richetti – Synopsys
  • E. Sanchez – Politecnico di Torino
  • S. Shoukourian – Synopsys
  • O. Sinanoglu – NYU Abu Dhabi
  • H. Stratigopoulos – Sorbonne University, CNRS, LIP6
  • S. Sunter – Mentor Graphics
  • M. Tehranipoor – University of Florida
  • C. Thibeault – ETS Montreal
  • L. C. Wang – University of California, Santa Barbara
  • H.J. Wunderlich – University of Stuttgart
Steering committee
  • M. Abadir – Abadir & Associates
  • J. Figueras – Universidad Polytecnic de Catalunya
  • A. Ivanov – University of British Columbia
  • M. Nicolaidis – TIMA Laboratory
  • P. Prinetto – Politecnico di Torino
  • A. Singh – Auburn University
  • P. Varma – Real Intent
  • Y. Zorian – Synopsys

For more information, visit us on the web at: http://www.tttc-vts.org

The 37th IEEE VLSI Test Symposium 2019 is sponsored by the Institute of Electrical and Electronics Engineers (IEEE) Computer Society's Test Technology Technical Council (TTTC).



IEEE Computer Society-Test Technology Technical Council

TTTC CHAIR
Chen-Huan CHIANG
Intel - USA
E-mail chen-huan.chiang@intel.com

PAST CHAIR
Michael NICOLAIDIS
TIMA laboratory - France
E-mail michael.nicolaidis@imag.fr

TTTC 1ST VICE CHAIR
Matteo SONZA REORDA
Politecnico di Torino - Italy
E-mail matteo.sonzareorda@polito.it

SECRETARY
Joan FIGUERAS
Un. Politec. de Catalunya - Spain
E-mail figueras@eel.upc.es

TEST WEEK COORDINATOR
Yervant ZORIAN
Synopsys, Inc. - USA
E-mail Yervant.Zorian@synopsys.com

TUTORIALS AND EDUCATION
Paolo BERNARDI

Politecnico di Torino
- Italy
E-mail paolo.bernardi@polito.it

STANDARDS
Rohit KAPUR

Synopsys
, Inc. - USA
E-mail rkapur@synopsys.com

EUROPE
Giorgio DI NATALE
LIRMM - France
E-mail giorgio.dinatale@lirmm.fr

MIDDLE EAST & AFRICA
Ibrahim HAJJ
American University of Beirut - Lebanon
E-mail ihajj@aub.edu.lb

STANDING COMMITTEES
André IVANOV
University of British Columbia - Canada
E-mail ivanov@ece.ubc.ca

ELECTRONIC MEDIA
Giorgio DI NATALE
LIRMM - France
E-mail giorgio.dinatale@lirmm.fr

 

PRESIDENT OF BOARD
Yervant ZORIAN
Synopsys, Inc. - USA
E-mail Yervant.Zorian@synopsys.com

SENIOR PAST CHAIR
Adith SINGH
Auburn University – USA
E-mail adsingh@eng.auburn.edu

TTTC 2ND VICE CHAIR
Rohit KAPUR
Synopsys, Inc. – USA
E-mail rkapur@synopsys.com

FINANCE
Chen-Huan CHIANG
Alcatel-Lucent - USA
E-mail chen-huan.chiang@alcatel-lucent.com

TECHNICAL MEETINGS
Chen-Huan CHIANG
Alcatel-Lucent
- USA
E-mail chenhuan@alcatel-lucent.com

TECHNICAL ACTIVITIES
Matteo SONZA REORDA
Politecnico di Torino - Italy
E-mail matteo.sonzareorda@polito.it

ASIA & PACIFIC
Kazumi HATAYAMA
NAIST - Japan
E-mail k-hatayama@is.naist.jp

LATIN AMERICA
Victor Hugo CHAMPAC
Instituto Nacional de Astrofisica - Mexico
E-mail champac@inaoep.mx

NORTH AMERICA
André IVANOV
University of British Columbia - Canada
E-mail ivanov@ece.ubc.ca

COMMUNICATIONS
Cecilia METRA
Università di Bologna - Italy
E-mail cmetra@deis.unibo.it

INDUSTRY ADVISORY BOARD
Yervant ZORIAN
Synopsys, Inc. - USA
E-mail Yervant.Zorian@synopsys.com


This message contains public information only. You are invited to copy and distribute it further.

For more information contact the TTTC office or visit http://tab.computer.org/tttc/

To remove or modify your contact information, or to register new users, please click here and follow the on-line instructions.